Unveiling the Powerhouse: HBM Technology

High Bandwidth Memory (HBM) stands at the forefront of memory technology, revolutionizing the way we approach data capacity and throughput. By ingeniously stacking DDR chips and integrating them with GPUs or CPUs, HBM delivers a quantum leap in performance, offering not only vast data bandwidth but also remarkable energy efficiency. This innovation positions HBM as the memory solution of choice for the most demanding applications in high-performance computing.

U.S. New Round of Export Restrictions on China: Chinese Enterprises' Response Strategies and International Cooperation

On December 2nd, the U.S. government announced a new round of export restrictions against China, adding over 140 Chinese companies to the trade restriction list, involving various types of semiconductor products, including semiconductor manufacturing equipment and electronic design automation tools.

The China Internet Association calls on domestic companies to proactively take countermeasures, carefully consider the procurement of U.S. chips, seek to expand cooperation with chip enterprises from other countries and regions, and actively use chips manufactured by both domestic and foreign-funded enterprises in China.

Subsidiaries of Shenzhen's Heavy Investment Group Breakthrough in SiC Technology, Alleviating Material Bottlenecks for New Energy and 5G

Companies under Shengtou Investment Group, such as Founder Microelectronics and Chongqing Silicon Valley, have achieved world-leading results in automotive-grade SiC MOS products and conductive SiC substrates, effectively addressing the raw material supply bottlenecks in key areas like new energy vehicles and 5G communications.

The United States Demands TSMC to Halt Supply of 7-Nanometer AI Chips to Mainland China

According to a report by Reuters on the 10th, the U.S. Department of Commerce sent a letter to TSMC, demanding that it cease supply of 7-nanometer and more advanced process AI chips to Mainland Chinese clients starting from the 11th. This export restriction measure primarily targets chips used in artificial intelligence accelerators and graphics processing units (GPUs).

The report states that the letter from the U.S. Department of Commerce allows the U.S. to bypass the relevant rule-making process and swiftly implement new licensing requirements for specific companies. In response, the U.S. Department of Commerce declined to comment.